Invention Grant
- Patent Title: Leveling spacer for laying wall tiles, paving tiles and the like with the interposition of gaps
- Patent Title (中): 用于铺设墙砖，铺路砖等的调平间隔件插入间隙
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Application No.: US13622624Application Date: 2012-09-19
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Publication No.: US08635815B2Publication Date: 2014-01-28
- Inventor: Lino Bordin
- Applicant: Progress Profiles SPA
- Applicant Address: IT
- Assignee: Progress Profiles SpA
- Current Assignee: Progress Profiles SpA
- Current Assignee Address: IT
- Agency: Cantor Colburn LLP
- Priority: ITPD2011A0295 20110920
- Main IPC: E04B2/82
- IPC: E04B2/82 ; E04B9/00 ; E04G1/22
Abstract:
A leveling spacer for laying wall tiles, paving tiles and the like with the interposition of gaps, which comprises a base with spacing protrusions for the abutment of the edges of corresponding tiles so as to define the width of the gaps, a threaded stem, which is fixed at right angles to the base in at least one easily breakable point, a knob for clamping and removing the threaded stem, which comprises a female threaded portion adapted to be screwed to the threaded stem.
Public/Granted literature
- US20130067854A1 LEVELING SPACER FOR LAYING WALL TILES, PAVING TILES AND THE LIKE WITH THE INTERPOSITION OF GAPS Public/Granted day:2013-03-21
Information query
