Invention Grant
- Patent Title: Reduced footprint substrate interleaver for food preparation line
- Patent Title (中): 减少用于食物制备线的基板交错器
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Application No.: US12995780Application Date: 2009-06-05
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Publication No.: US08635837B2Publication Date: 2014-01-28
- Inventor: Lawrence Ward , Dante Pietrinferni , Allen Ely
- Applicant: Lawrence Ward , Dante Pietrinferni , Allen Ely
- Applicant Address: US PA Collegeville
- Assignee: Packaging Progressions, Inc.
- Current Assignee: Packaging Progressions, Inc.
- Current Assignee Address: US PA Collegeville
- Agency: Volpe and Koenig, P.C.
- International Application: PCT/US2009/046362 WO 20090605
- International Announcement: WO2009/149322 WO 20091210
- Main IPC: B65B25/08
- IPC: B65B25/08
Abstract:
A food processing system having a slicer/former for food preparations having a feed conveyor, a stacker for stacking food preparations, and n interleaver for inserting a substrate under a food preparation from the food slicer/former as it transitions to the stacker. The interleaver is arranged such that a portion of the interleaver is located beneath the feed conveyor of the slicer/former. The interleaver includes an interleaver conveyor which extends from the feed conveyor to the stacker in-feed conveyor, and an overall length of the interleaver conveyor is less than a length of the interleaver in order to provide a reduced footprint interleaver for new and retro-fit applications having a limited length for the food processing system.
Public/Granted literature
- US20110081225A1 REDUCED FOOTPRINT SUBSTRATE INTERLEAVER FOR FOOD PREPARATION LINE Public/Granted day:2011-04-07
Information query
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