Invention Grant
- Patent Title: Ultrasonic coupler assembly
- Patent Title (中): 超声波耦合器总成
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Application No.: US13091464Application Date: 2011-04-21
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Publication No.: US08635913B2Publication Date: 2014-01-28
- Inventor: Xiaolei Shirley Ao , Oleg Alexander Khrakovsky , Christopher Alan Frail , Amber Yue Ma
- Applicant: Xiaolei Shirley Ao , Oleg Alexander Khrakovsky , Christopher Alan Frail , Amber Yue Ma
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Hiscock & Barclay LLP
- Main IPC: G01N29/28
- IPC: G01N29/28
Abstract:
An ultrasonic coupler assembly for coupling an ultrasonic transducer to a pipe wall is disclosed, wherein the ultrasonic coupler is configured using three quadrilateral sections to reduce the temperature extreme to which the ultrasonic transducer is exposed and to improve the quality of the ultrasonic signal passing through the ultrasonic coupler.
Public/Granted literature
- US20120266679A1 ULTRASONIC COUPLER ASSEMBLY Public/Granted day:2012-10-25
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