Invention Grant
- Patent Title: Surface mount contact and connector using same
- Patent Title (中): 表面贴装触点和连接器使用相同
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Application No.: US13186864Application Date: 2011-07-20
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Publication No.: US08636523B2Publication Date: 2014-01-28
- Inventor: Taisuke Nagasaki , Hirokazu Kato
- Applicant: Taisuke Nagasaki , Hirokazu Kato
- Applicant Address: JP Kanagawa-ken
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Barley Snyder
- Priority: JP2010-163287 20100720
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A connector includes a surface mount contact and housing. The surface mount contact has a cylindrical portion, a lance, and a pair of surface mount soldering portions. The cylindrical portion has a cylindrical shape into which a wire core of an electrical wire is inserted. The lance is positioned in an intermediate portion of the cylindrical portion along an axial direction thereof and secures the wire core when the electrical wire is inserted. The pair of surface mount soldering portions project from the cylindrical portion. Each of the pair of surface mount soldering portions extend from an end of the cylindrical portion in a direction orthogonal to the axial direction.
Public/Granted literature
- US20120021657A1 Surface Mount Contact And Connector Using Same Public/Granted day:2012-01-26
Information query
