Invention Grant
- Patent Title: Electrical connector grounding path to outer shell
- Patent Title (中): 电连接器到外壳的接地路径
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Application No.: US13092333Application Date: 2011-04-22
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Publication No.: US08636540B2Publication Date: 2014-01-28
- Inventor: Jian-Ming Bu
- Applicant: Jian-Ming Bu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Ming Chieh Chang; Wei Te Chung
- Priority: CN201010154121 20100423
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
An electrical connector (100) comprising a housing (200) defining a front face and a first mating cavity recessed rearward from the front face for receiving a modular plug, an electronic module (400) mounted to the housing, a horizontal PCB (500) mounted under the electronic module, and an outer shell (700) shielding the electronic module and the housing. The electronic module has a vertical PCB(420) which includes a ground trace (421) joined to a conductor (427) that extends through a plated hole in the vertical PCB and that is connected to a conductive pin (722) of the outer shell through a conductive trace (56) of the horizontal PCB (500).
Public/Granted literature
- US20110263157A1 ELECTRICAL CONNECTOR GROUNDING PATH TO OUTER SHELL Public/Granted day:2011-10-27
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