A footprint of an electronic assembly formed from conductive pads on a surface of a printed circuit board. One or more vias may connect each pad to a conductive structure within the printed circuit board. The footprint may be such that the vias for the pads are aligned along columns, leaving wide routing channels between the columns. The pads may have different shapes. For example, some of the pads may each have two solder attachment regions that are electrically connected to a ground plane, while other pads may each have one solder attachment region that is electrically connected to a signal trace. The solder attachment regions may be arranged in such a pattern that they align with respective contact tails of a connector assembly. A signal path may be formed between a solder attachment region and a corresponding contact tail through a solder ball attached to the contact tail.