Invention Grant
- Patent Title: Polishing head and polishing apparatus
- Patent Title (中): 抛光头和抛光装置
-
Application No.: US13056249Application Date: 2009-08-07
-
Publication No.: US08636561B2Publication Date: 2014-01-28
- Inventor: Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
- Applicant: Hisashi Masumura , Hiromasa Hashimoto , Kouji Morita , Hiromi Kishida , Satoru Arakawa
- Applicant Address: JP Tokyo JP Nagano
- Assignee: Shin-Etsu Handotai Co., Ltd.,Fujikoshi Machinery Corp.
- Current Assignee: Shin-Etsu Handotai Co., Ltd.,Fujikoshi Machinery Corp.
- Current Assignee Address: JP Tokyo JP Nagano
- Agency: Oliff & Berridge, PLC
- Priority: JP2008-222039 20080829
- International Application: PCT/JP2009/003796 WO 20090807
- International Announcement: WO2010/023829 WO 20100304
- Main IPC: B24B37/04
- IPC: B24B37/04 ; H01L21/304
Abstract:
A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.
Public/Granted literature
- US20110136414A1 POLISHING HEAD AND POLISHING APPARATUS Public/Granted day:2011-06-09
Information query
