Invention Grant
- Patent Title: Method for manufacturing laminated board, and laminated board
- Patent Title (中): 叠层板的制造方法和层压板
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Application No.: US12529710Application Date: 2008-03-13
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Publication No.: US08636868B2Publication Date: 2014-01-28
- Inventor: Kazuyuki Yoshizaki , Maroshi Yuasa
- Applicant: Kazuyuki Yoshizaki , Maroshi Yuasa
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2007-071967 20070320; JP2007-071969 20070320
- International Application: PCT/JP2008/000573 WO 20080313
- International Announcement: WO2008/129784 WO 20081030
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B29C47/76 ; B29C45/00 ; B29C47/00 ; B29C39/02 ; B29C43/02 ; B29C49/00 ; B29C49/08 ; B29C67/00 ; B29D22/00 ; B29C51/00 ; B29D24/00 ; B29D29/00 ; B29C43/10 ; B28B21/36 ; A23P1/00 ; B29B11/06 ; B29C35/00 ; A01J21/00 ; A01J25/12 ; A21C3/00 ; A21C11/00 ; A23G1/20 ; A23G3/02 ; B28B11/08 ; B29C55/28
Abstract:
A method for manufacturing a laminated board, comprising: preparing a first and a second prepregs 30a, 30b with a carrier by laminating the carrier with an insulating resin layer in which a fiber cloth is embedded, and laminating the first and the second prepregs 30a, 30b with a carrier by bonding the insulating resin layer in the first prepreg 31a with a carrier and the insulating resin layer in the second prepreg 31b with a carrier directly or via an additional member under reduced pressure and heating it.
Public/Granted literature
- US20100297420A1 METHOD FOR MANUFACTURING LAMINATED BOARD, AND LAMINATED BOARD Public/Granted day:2010-11-25
Information query
