Invention Grant
- Patent Title: Electro chemical deposition systems and methods of manufacturing using the same
- Patent Title (中): 电化学沉积系统及使用其的制造方法
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Application No.: US13452298Application Date: 2012-04-20
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Publication No.: US08636879B2Publication Date: 2014-01-28
- Inventor: Moosung Chae , Bum Ki Moon , Sunoo Kim , Danny Pak-Chum Shum
- Applicant: Moosung Chae , Bum Ki Moon , Sunoo Kim , Danny Pak-Chum Shum
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: C25D21/12
- IPC: C25D21/12 ; C25D17/00
Abstract:
An electro chemical deposition system is described for forming a feature on a semiconductor wafer. The electro chemical deposition is performed by powering electrodes that includes a cathode, an anode and a plurality of electrically independent auxiliary electrodes.
Public/Granted literature
- US20120205238A1 Electro Chemical Deposition Systems and Methods of Manufacturing Using the Same Public/Granted day:2012-08-16
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