Invention Grant
- Patent Title: Surface acoustic wave sensing device
- Patent Title (中): 表面声波感测装置
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Application No.: US13853039Application Date: 2013-03-28
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Publication No.: US08636953B2Publication Date: 2014-01-28
- Inventor: Hiroshi Katta
- Applicant: Kyocera Corporation
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Duane Morris LLP
- Priority: JP2012-073528 20120328
- Main IPC: H01L27/20
- IPC: H01L27/20

Abstract:
A SAW sensor includes a substrate, first and second IDT on the substrate and a detector portion between the first and second IDT. The first IDT generates a surface acoustic wave in response to a high-frequency signal input. The second IDT receives the SAW from the first IDT, and converts the SAW to an electric signal and outputs the electric signal. A one pulse signal, which is input to the first IDT electrode, has an applying time that is at least as long as a delay time of a surface acoustic wave at the detector less an arrival time of a direct wave attributable to electromagnetic coupling between the first IDT and the second IDT electrode, and that is less than an arrival time at the second IDT of a third response wave of the surface acoustic wave from the first IDT.
Public/Granted literature
- US20130259746A1 SURFACE ACOUSTIC WAVE SENSING DEVICE Public/Granted day:2013-10-03
Information query
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