Invention Grant
- Patent Title: Fluid connectors for microreactor modules
- Patent Title (中): 用于微反应器模块的流体连接器
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Application No.: US13641323Application Date: 2011-04-12
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Publication No.: US08636964B2Publication Date: 2014-01-28
- Inventor: Pierre Brunello , Paul Louis Florent Delautre , Sylvain Maxime F Gremetz , Olivier Lobet
- Applicant: Pierre Brunello , Paul Louis Florent Delautre , Sylvain Maxime F Gremetz , Olivier Lobet
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Gregory V. Bean
- Priority: EP10305405 20100419
- International Application: PCT/US2011/032001 WO 20110412
- International Announcement: WO2011/136915 WO 20111103
- Main IPC: B01L99/00
- IPC: B01L99/00

Abstract:
An end-face sealing fluidic connector for fluidic connection and/or interconnection of glass, glass-ceramic and/or ceramic fluidic modules in a microreactor includes a connector body having a circular first end face with a recess for retaining one or more O-rings and a first end section having a circular cylindrical outeT surface and a diameter In the range of from 3 to 25 mm. The outer surface has a circumferential recess dividing the first end section into a proximal portion adjacent the first end face and a distal portion. A retaining ring is seated in the circumferential recess and a protecting ring coinpming a high-compression-strength polymer surrounds the proximal portion of the first end section. A circular cylindrical sleeve surrounds the first end section and the reinforcing and/or protecting ring, the sleeve including a circumferentially extending inside bearing surface for engaging the retaining ring on the distal side thereof.
Public/Granted literature
- US20130034475A1 FLUID CONNECTORS FOR MICROREACTOR MODULES Public/Granted day:2013-02-07
Information query
IPC分类: