Invention Grant
- Patent Title: Device including a semiconductor chip and a carrier and fabrication method
- Patent Title (中): 装置包括半导体芯片和载体及制造方法
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Application No.: US12575532Application Date: 2009-10-08
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Publication No.: US08637379B2Publication Date: 2014-01-28
- Inventor: Hannes Eder , Ivan Nikitin , Manfred Schneegans , Jens Goerlich , Karsten Guth , Alexander Heinrich
- Applicant: Hannes Eder , Ivan Nikitin , Manfred Schneegans , Jens Goerlich , Karsten Guth , Alexander Heinrich
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig, Czaja, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/30 ; H01L21/46 ; H01L21/44 ; H01L21/50 ; H01L21/60
Abstract:
A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier.
Public/Granted literature
- US20110084369A1 DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION METHOD Public/Granted day:2011-04-14
Information query
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