Invention Grant
US08637389B2 Resist feature and removable spacer pitch doubling patterning method for pillar structures
有权
支柱结构的抗蚀特征和可移除的间隔物间距倍增图案化方法
- Patent Title: Resist feature and removable spacer pitch doubling patterning method for pillar structures
- Patent Title (中): 支柱结构的抗蚀特征和可移除的间隔物间距倍增图案化方法
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Application No.: US13744971Application Date: 2013-01-18
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Publication No.: US08637389B2Publication Date: 2014-01-28
- Inventor: Yung-Tin Chen , Steven J. Radigan
- Applicant: SanDisk 3D LLC
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
A method of making a memory array is provided that includes forming a layer over a substrate, forming features over the layer, forming sidewall spacers on each of the features, filling spaces between adjacent sidewall spacers with filler features, removing the sidewall spacers to leave the features and the filler features, and etching the layer using the features and the filler features as a mask to form pillar shaped nonvolatile memory cells. Numerous other aspects are provided.
Public/Granted literature
- US20130130467A1 RESIST FEATURE AND REMOVABLE SPACER PITCH DOUBLING PATTERNING METHOD FOR PILLAR STRUCTURES Public/Granted day:2013-05-23
Information query
IPC分类: