Invention Grant
- Patent Title: Solder interconnect with non-wettable sidewall pillars and methods of manufacture
- Patent Title (中): 具有不可润湿侧壁柱的焊接互连和制造方法
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Application No.: US12700863Application Date: 2010-02-05
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Publication No.: US08637392B2Publication Date: 2014-01-28
- Inventor: Charles L. Arvin , Raschid J. Bezama , Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , David L. Questad , Wolfgang Sauter , Timothy D. Sullivan , Brian R. Sundlof
- Applicant: Charles L. Arvin , Raschid J. Bezama , Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , David L. Questad , Wolfgang Sauter , Timothy D. Sullivan , Brian R. Sundlof
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Richard Kotulak
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.
Public/Granted literature
- US20110193218A1 Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture Public/Granted day:2011-08-11
Information query
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