Invention Grant
- Patent Title: Integrated circuit package system with flex bump
- Patent Title (中): 具有弯曲凸块的集成电路封装系统
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Application No.: US11773886Application Date: 2007-07-05
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Publication No.: US08637394B2Publication Date: 2014-01-28
- Inventor: Jairus Legaspi Pisigan , Henry Descalzo Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- Applicant: Jairus Legaspi Pisigan , Henry Descalzo Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48
Abstract:
An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect.
Public/Granted literature
- US20090008761A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP Public/Granted day:2009-01-08
Information query
IPC分类:
