Invention Grant
US08637777B2 Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate
有权
具有散热器的功率模块基板，其制造方法，具有散热器的功率模块和功率模块基板
- Patent Title: Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate
- Patent Title (中): 具有散热器的功率模块基板，其制造方法，具有散热器的功率模块和功率模块基板
-
Application No.: US12922732Application Date: 2009-03-11
-
Publication No.: US08637777B2Publication Date: 2014-01-28
- Inventor: Hiromasa Hayashi , Takeshi Kitahara , Hiroshi Tonomura , Hiroya Ishizuka , Yoshirou Kuromitsu
- Applicant: Hiromasa Hayashi , Takeshi Kitahara , Hiroshi Tonomura , Hiroya Ishizuka , Yoshirou Kuromitsu
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Materials Corporation
- Current Assignee: Mitsubishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Agent James E. Armstrong, IV
- Priority: JP2008-067344 20080317; JP2008-234997 20080912
- International Application: PCT/JP2009/054654 WO 20090311
- International Announcement: WO2009/116439 WO 20090924
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H05K1/00
Abstract:
A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55≦B/A≦20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B.
Public/Granted literature
Information query
