Invention Grant
- Patent Title: Semiconductor device including phase change material and method of manufacturing same
- Patent Title (中): 包括相变材料的半导体器件及其制造方法
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Application No.: US13370693Application Date: 2012-02-10
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Publication No.: US08637843B2Publication Date: 2014-01-28
- Inventor: Isamu Asano
- Applicant: Isamu Asano
- Agency: Foley & Lardner LLP
- Priority: JP2011-034220 20110221
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
Disclosed herein is a device that includes: an interlayer insulation film having a through hole; and a phase change storage element provided in the through hole. The phase change storage element includes: an outer electrode being a conductive film of cylindrical shape and being formed along an inner wall of the through hole; a buffer insulation film being an insulation film of cylindrical shape and being formed along an inner wall of the outer electrode, an upper end of the buffer insulation film being recessed in part to form a recess; a phase change film filling an interior of the recess; and an inner electrode being a conductive film formed along an inner wall of the buffer insulation film including a surface of the phase change film.
Public/Granted literature
- US20120211715A1 SEMICONDUCTOR DEVICE INCLUDING PHASE CHANGE MATERIAL AND METHOD OF MANUFACTURING SAME Public/Granted day:2012-08-23
Information query
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