Invention Grant
- Patent Title: Electronic components with integrated encapsulation
- Patent Title (中): 电子元件集成封装
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Application No.: US13055916Application Date: 2009-07-22
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Publication No.: US08637856B2Publication Date: 2014-01-28
- Inventor: Bernard Ratier , Jean-Michel Nunzi , André Moliton , Mohamad Chakaroun
- Applicant: Bernard Ratier , Jean-Michel Nunzi , André Moliton , Mohamad Chakaroun
- Applicant Address: FR Paris Cedex
- Assignee: Centre National de la Recherche Scientifique—CNRS
- Current Assignee: Centre National de la Recherche Scientifique—CNRS
- Current Assignee Address: FR Paris Cedex
- Agency: Graybeal Jackson LLP
- Agent Bryan A. Santarelli
- Priority: FR0855122 20080725
- International Application: PCT/FR2009/000911 WO 20090722
- International Announcement: WO2010/010254 WO 20100128
- Main IPC: H01L29/08
- IPC: H01L29/08
Abstract:
An embodiment relates to an electronic component that may consist of an organic LED or organic solar cell, that comprises at least one substrate, one active layer provided between a first and a second electrode and having an active layer protected from dioxygen and the water vapor of the air by the second electrode that encapsulates the active layer.
Public/Granted literature
- US20120104365A1 ELECTRONIC COMPONENTS WITH INTEGRATED ENCAPSULATION Public/Granted day:2012-05-03
Information query
IPC分类:
