Invention Grant
US08637958B2 Structure and method for forming isolation and buried plate for trench capacitor
有权
用于形成沟槽电容器的隔离和掩埋板的结构和方法
- Patent Title: Structure and method for forming isolation and buried plate for trench capacitor
- Patent Title (中): 用于形成沟槽电容器的隔离和掩埋板的结构和方法
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Application No.: US13617576Application Date: 2012-09-14
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Publication No.: US08637958B2Publication Date: 2014-01-28
- Inventor: Abhishek Dube , Subramanian S. Iyer , Babar Ali Khan , Oh-jung Kwon , Junedong Lee , Paul C. Parries , Chengwen Pei , Gerd Pfeiffer , Ravi Todi , Geng Wang
- Applicant: Abhishek Dube , Subramanian S. Iyer , Babar Ali Khan , Oh-jung Kwon , Junedong Lee , Paul C. Parries , Chengwen Pei , Gerd Pfeiffer , Ravi Todi , Geng Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joseph P. Abate; Howard M. Cohn
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A structure and method for forming isolation and a buried plate for a trench capacitor is disclosed. Embodiments of the structure comprise an epitaxial layer serving as the buried plate, and a bounded deep trench isolation area serving to isolate one or more deep trench structures. Embodiments of the method comprise angular implanting of the deep trench isolation area to form a P region at the base of the deep trench isolation area that serves as an anti-punch through implant.
Public/Granted literature
- US20130009277A1 STRUCTURE AND METHOD FOR FORMING ISOLATION AND BURIED PLATE FOR TRENCH CAPACITOR Public/Granted day:2013-01-10
Information query
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