Invention Grant
US08637962B2 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
失效
包括至少一个盲孔的半导体管芯，包括这种半导体管芯的晶片，以及在衬底中形成至少一个盲孔而制成的中间产品
- Patent Title: Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
- Patent Title (中): 包括至少一个盲孔的半导体管芯，包括这种半导体管芯的晶片，以及在衬底中形成至少一个盲孔而制成的中间产品
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Application No.: US13620065Application Date: 2012-09-14
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Publication No.: US08637962B2Publication Date: 2014-01-28
- Inventor: Salman Akram , Sidney B. Rigg
- Applicant: Salman Akram , Sidney B. Rigg
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/4763
- IPC: H01L21/4763
Abstract:
Semiconductor dice comprise at least one bond pad on an active surface of the semiconductor die. At least one blind hole extends from a back surface of the semiconductor die opposing the active surface, through a thickness of the semiconductor die, to an underside of the at least one bond pad. At least one quantity of passivation material covers at least a sidewall surface of the at least one blind hole. At least one conductive material is disposed in the at least one blind hole adjacent and in electrical communication with the at least one bond pad and adjacent the at least one quantity of passivation material.
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