Invention Grant
US08637977B2 Semiconductor device and method of packaging a semiconductor device with a clip
有权
用夹子封装半导体器件的半导体器件和方法
- Patent Title: Semiconductor device and method of packaging a semiconductor device with a clip
- Patent Title (中): 用夹子封装半导体器件的半导体器件和方法
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Application No.: US13928835Application Date: 2013-06-27
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Publication No.: US08637977B2Publication Date: 2014-01-28
- Inventor: Boon Huat Lim , Chee Chian Lim , Yoke Chin Goh
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
Public/Granted literature
- US20130285249A1 SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE WITH A CLIP Public/Granted day:2013-10-31
Information query
IPC分类:
