Invention Grant
- Patent Title: Multi-chip package with pillar connection
- Patent Title (中): 多芯片封装，支柱连接
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Application No.: US13088817Application Date: 2011-04-18
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Publication No.: US08637984B2Publication Date: 2014-01-28
- Inventor: Roland Schuetz
- Applicant: Roland Schuetz
- Applicant Address: CA Ottawa, Ontario
- Assignee: Mosaid Technologies Incorporated
- Current Assignee: Mosaid Technologies Incorporated
- Current Assignee Address: CA Ottawa, Ontario
- Agent Harvey Auerback
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/58
Abstract:
A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.
Public/Granted literature
- US20110298128A1 MULTI-CHIP PACKAGE WITH PILLAR CONNECTION Public/Granted day:2011-12-08
Information query
IPC分类:
