Invention Grant
- Patent Title: Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
- Patent Title (中): 微机械方法和相应的组装，用于接合半导体衬底和相应的键合半导体芯片
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Application No.: US13509163Application Date: 2010-09-23
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Publication No.: US08638000B2Publication Date: 2014-01-28
- Inventor: Achim Trautmann , Ralf Reichenbach
- Applicant: Achim Trautmann , Ralf Reichenbach
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck
- Priority: DE102009046687 20091113
- International Application: PCT/EP2010/064009 WO 20100923
- International Announcement: WO2011/057850 WO 20110519
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.
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Information query
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