Invention Grant
- Patent Title: Transcapacitive sensor devices with ohmic seams
- Patent Title (中): 具有欧姆接缝的Transcapacitive传感器设备
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Application No.: US12970898Application Date: 2010-12-16
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Publication No.: US08638107B2Publication Date: 2014-01-28
- Inventor: Adam Schwartz , Kirk Hargreaves , Joseph Kurth Reynolds , Richard R. Schediwy
- Applicant: Adam Schwartz , Kirk Hargreaves , Joseph Kurth Reynolds , Richard R. Schediwy
- Applicant Address: US CA San Jose
- Assignee: Synaptics Incorporated
- Current Assignee: Synaptics Incorporated
- Current Assignee Address: US CA San Jose
- Main IPC: G01R27/26
- IPC: G01R27/26 ; G06F3/041

Abstract:
A transcapacitive sensing device has and ohmic seam which sections a plurality of transmitter electrodes and also sections a plurality of receiver electrodes. A processing system is communicatively coupled with the transmitter electrodes and the receiver electrodes and configured to: transmit a first transmitter signal with a first transmitter electrode disposed on a first side of the ohmic seam; transmit a second transmitter signal with a second transmitter electrode disposed on a second side of the ohmic seam; receive a first response corresponding to said first transmitter signal with a first receiver electrode disposed on the first side of the ohmic seam; and receive a second response corresponding to said second transmitter signal with a second receiver electrode disposed on the second side of the ohmic seam.
Public/Granted literature
- US20110148435A1 TRANSCAPACITIVE SENSOR DEVICES WITH OHMIC SEAMS Public/Granted day:2011-06-23
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