Invention Grant
US08638117B2 Production device, production method, test apparatus and integrated circuit package
有权
生产装置，生产方法，试验装置及集成电路封装
- Patent Title: Production device, production method, test apparatus and integrated circuit package
- Patent Title (中): 生产装置，生产方法，试验装置及集成电路封装
-
Application No.: US12878993Application Date: 2010-09-09
-
Publication No.: US08638117B2Publication Date: 2014-01-28
- Inventor: Yoshinari Kogure , Seiichi Takasu , Sadaki Tanaka
- Applicant: Yoshinari Kogure , Seiichi Takasu , Sadaki Tanaka
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2009-240882 20091019
- Main IPC: H01L31/20
- IPC: H01L31/20
Abstract:
Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package.
Public/Granted literature
- US20110089550A1 PRODUCTION DEVICE, PRODUCTION METHOD, TEST APPARATUS AND INTEGRATED CIRCUIT PACKAGE Public/Granted day:2011-04-21
Information query
IPC分类:
