Invention Grant
- Patent Title: Low profile inductors for high density circuit boards
- Patent Title (中): 用于高密度电路板的低调电感器
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Application No.: US13297216Application Date: 2011-11-15
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Publication No.: US08638187B2Publication Date: 2014-01-28
- Inventor: Alexandr Ikriannikov
- Applicant: Alexandr Ikriannikov
- Applicant Address: US CA San Jose
- Assignee: Volterra Semiconductor Corporation
- Current Assignee: Volterra Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lathrop & Gage LLP
- Main IPC: H01F27/29
- IPC: H01F27/29

Abstract:
An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.
Public/Granted literature
- US20120056703A1 Low Profile Inductors For High Density Circuit Boards Public/Granted day:2012-03-08
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