Invention Grant
- Patent Title: Methods and apparatus for applying tactile pressure sensors
- Patent Title (中): 应用触觉压力传感器的方法和装置
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Application No.: US12712873Application Date: 2010-02-25
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Publication No.: US08638236B2Publication Date: 2014-01-28
- Inventor: An M. Chen , Jack Steenstra
- Applicant: An M. Chen , Jack Steenstra
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Charles Chesney
- Main IPC: G08C19/16
- IPC: G08C19/16 ; G01S19/19
Abstract:
A method of wireless communication includes transmitting configuration information to a tactile pressure sensor apparatus, receiving pressure sensor data from the tactile pressure sensor apparatus based on the configuration information, and providing the received tactile pressure sensor data to a user.
Public/Granted literature
- US20110205081A1 METHODS AND APPARATUS FOR APPLYING TACTILE PRESSURE SENSORS Public/Granted day:2011-08-25
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