Invention Grant
- Patent Title: Method for defect determination in fine concave-convex pattern and method for defect determination on patterned medium
- Patent Title (中): 精细凹凸图案中缺陷测定方法及图案化介质缺陷测定方法
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Application No.: US12789188Application Date: 2010-05-27
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Publication No.: US08638430B2Publication Date: 2014-01-28
- Inventor: Hideaki Sasazawa , Takenori Hirose , Shigeru Serikawa
- Applicant: Hideaki Sasazawa , Takenori Hirose , Shigeru Serikawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2009-128996 20090528
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/956 ; H01L21/66 ; G01N21/95

Abstract:
In the inspection of a defect in a fine concave-convex pattern, a spectral waveform of a detection area of an inspection object is detected, area determination as to which area section determined by a pattern type of the inspection object the detection area belongs to is performed, a feature calculation equation and a determination index value which correspond to a determined area section and vary according to defect type is selected, feature calculation on the spectral waveform data in accordance with the selected feature calculation equation is performed, and a calculated feature value and the selected determination index value are compared to perform determination processing according to defect type.
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