In a rotating device, a housing includes a cylindrical outer surface facing an inner surface of a through hole and a guiding surface arranged on the underside of the outer surface, the diameter of the guiding surface being less than the diameter of the outer surface. Glue has an interface in an end space. In at least a part of the end space where the glue does not exist, conductive resin seamlessly is applied from the guiding surface to the inner surface of the through hole. With regard to a portion of the inner surface of the through hole that radially faces the guiding surface, the length, in the axial direction, of the portion that touches the conductive resin is greater than the length, in the axial direction, of the portion that touches the glue.