Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13486783Application Date: 2012-06-01
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Publication No.: US08638533B2Publication Date: 2014-01-28
- Inventor: Akio Uenishi
- Applicant: Akio Uenishi
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-125448 20110603
- Main IPC: H02H9/00
- IPC: H02H9/00 ; H02H3/20 ; H02H9/04

Abstract:
A semiconductor device includes a first node receiving an external voltage, a second node receiving a grounding voltage, a protection circuit, and a device to be protected coupled in parallel between the first and second nodes, in which the protection circuit includes a lateral IGBT having an emitter coupled to the second node and an avalanche diode having an anode coupled to the collector of the lateral IGBT and a cathode coupled to the first node, and a clamp driving circuit coupled between the first and second nodes, and coupled to the gate of the lateral IGBT.
Public/Granted literature
- US20120307407A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-12-06
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