Invention Grant
- Patent Title: Earphone, headset and ear pad
- Patent Title (中): 耳机，耳机和耳垫
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Application No.: US12643351Application Date: 2009-12-21
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Publication No.: US08638969B2Publication Date: 2014-01-28
- Inventor: Jan Peter Kuhtz , Olav Nisse , Olaf Leske , Steffi Beier
- Applicant: Jan Peter Kuhtz , Olav Nisse , Olaf Leske , Steffi Beier
- Applicant Address: DE Wedemark
- Assignee: Sennheiser electronic GmbH & Co. KG
- Current Assignee: Sennheiser electronic GmbH & Co. KG
- Current Assignee Address: DE Wedemark
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: DE202008016854U 20081222
- Main IPC: H04R25/00
- IPC: H04R25/00
Abstract:
An earphone, a headset, and an ear pad for an earphone. The ear pad may having the sealing integrity guaranteed. The headset may have portions with different degrees of softness or firmness.
Public/Granted literature
- US20100158301A1 EARPHONE, HEADSET AND EAR PAD Public/Granted day:2010-06-24
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