Invention Grant
- Patent Title: Method and apparatus for inspecting pattern defects
- Patent Title (中): 检查图案缺陷的方法和装置
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Application No.: US13611664Application Date: 2012-09-12
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Publication No.: US08639019B2Publication Date: 2014-01-28
- Inventor: Kaoru Sakai , Shunji Maeda , Takafumi Okabe
- Applicant: Kaoru Sakai , Shunji Maeda , Takafumi Okabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2003-390655 20031120
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method of detecting a defect, including the steps of: illuminating step for illuminating a sample with a light; detecting step for detecting light from the specimen which is illuminated by the light and forming an image by processing the detected light; processing step for extracting a defect candidate by processing the image of the sample formed in the detecting step and determining an inspection condition by using images including the image of the sample acquired in the detecting step, a partial image including the extracted defect candidate and a reference image which corresponds to the partial image including the defect candidate.
Public/Granted literature
- US20130004057A1 METHOD AND APPARATUS FOR INSPECTING PATTERN DEFECTS Public/Granted day:2013-01-03
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