Invention Grant
- Patent Title: Fabrication method of optical wiring board and optical printed circuit board
- Patent Title (中): 光接线板和光电印刷电路板的制作方法
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Application No.: US12866180Application Date: 2009-01-14
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Publication No.: US08639067B2Publication Date: 2014-01-28
- Inventor: Yasunobu Matsuoka
- Applicant: Yasunobu Matsuoka
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2008-028652 20080208
- International Application: PCT/JP2009/000103 WO 20090114
- International Announcement: WO2009/098834 WO 20090813
- Main IPC: G02B6/12
- IPC: G02B6/12

Abstract:
The fabrication of an optical wiring board is performed in the following manner: A core member 13 for a mirror 22 is pattern-formed on a clad layer 11, and simultaneously, using the core member 13, each alignment mark pattern 14 is formed at any position on the clad layer 11. Further, with positioning in reference to each alignment mark 14, the core pattern 13 is subjected to physical cutting to form a bevel part and a concave part 23. Then, a metallic reflective film 18 is coated on the surface of the bevel part. Thereafter, with positioning in reference to each alignment mark 14, an optical wiring core pattern 20 is formed on the clad layer 11 adjacently to the mirror 22.
Public/Granted literature
- US20110052118A1 Fabrication Method of Optical Wiring Board and Optical Printed Circuit Board Public/Granted day:2011-03-03
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