Invention Grant
US08639240B2 Device manufacturing using the device's embedded wireless technology
失效
器件制造采用该器件的嵌入式无线技术
- Patent Title: Device manufacturing using the device's embedded wireless technology
- Patent Title (中): 器件制造采用该器件的嵌入式无线技术
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Application No.: US13543464Application Date: 2012-07-06
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Publication No.: US08639240B2Publication Date: 2014-01-28
- Inventor: Christopher Mark Romine , Dennis Michael Feenaghty , Joseph Patrick Burke , Sanjay K Jha , Samir S Soliman
- Applicant: Christopher Mark Romine , Dennis Michael Feenaghty , Joseph Patrick Burke , Sanjay K Jha , Samir S Soliman
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent William M. Hooks
- Main IPC: H04W24/00
- IPC: H04W24/00

Abstract:
Embodiments describe manufacturing, programming, testing, and servicing of wireless computing devices utilizing their embedded wireless technology. An embodiment method ensures that the wireless computing devices are successfully programmed in the event a disruption to the manufacturing, programming, testing and servicing process flow occurs. The method includes retrieving a last known location of the wireless device before the disruption event and comparing the last known location with the location of the wireless of the wireless device after the disruption event. A wireless device may be returned to the last known location before the disruption event if there is a difference in locations. The programming at the last known location before the disruption event occurred may be successfully completed. Further embodiments include configuring the manufacturing, programming, testing, and servicing of wireless computing devices utilizing the embedded wireless technology in the device based on a reported location of the device within a facility.
Public/Granted literature
- US20120276887A1 DEVICE MANUFACTURING USING THE DEVICE'S EMBEDDED WIRELESS TECHNOLOGY Public/Granted day:2012-11-01
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