Invention Grant
- Patent Title: Multi-electrode implantable systems and assemblies therefor
- Patent Title (中): 多电极植入系统及其组件
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Application No.: US13962987Application Date: 2013-08-09
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Publication No.: US08639341B2Publication Date: 2014-01-28
- Inventor: John Louis Sommer , Joseph Michael D'Sa , Joyce K Yamamoto , Brad C Tischendorf , James D Reinke , Andrew J Thom , Thomas P Miltich , William John Taylor , Kenneth C Gardeski , Larry Earl Tyler , Jeffrey O York , Gordon O Munns
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler
- Priority: WOPCT/US2011/034455 20110429
- Main IPC: A61N1/362
- IPC: A61N1/362

Abstract:
Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
Public/Granted literature
- US20130325086A1 MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREFOR Public/Granted day:2013-12-05
Information query
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