Invention Grant
US08639352B2 Wire configuration and method of making for an implantable medical apparatus 有权
电线配置和可植入医疗器械的制造方法

  • Patent Title: Wire configuration and method of making for an implantable medical apparatus
  • Patent Title (中): 电线配置和可植入医疗器械的制造方法
  • Application No.: US12419082
    Application Date: 2009-04-06
  • Publication No.: US08639352B2
    Publication Date: 2014-01-28
  • Inventor: Ling WangBernard Q. Li
  • Applicant: Ling WangBernard Q. Li
  • Applicant Address: US MN Minneapolis
  • Assignee: Medtronic, Inc.
  • Current Assignee: Medtronic, Inc.
  • Current Assignee Address: US MN Minneapolis
  • Agency: Medtronic, Inc.
  • Agent Beth L. McMahon
  • Main IPC: A61N1/04
  • IPC: A61N1/04
Wire configuration and method of making for an implantable medical apparatus
Abstract:
A filar includes an inner conductive core that is formed of a low-resistivity material such as silver having a resistivity of less than 20 μΩ per centimeter. A conductive coil is provided around the core to form a filar. This coil is formed of a biocompatible alloy or super alloy having an ultimate tensile strength (UTS) of between 150 kilo pounds per square inch (ksi) and 280 ksi at room temperature. Examples of such alloys include CoCrMo, CoFeCrMo, and CoFeNiCrMo. In one specific embodiment, the alloy is MP35N (CoNiCrMo), which may be low-titanium (“low-ti”) MP35N. One or more such filars may be included within a wire. This wire may be carried by an implantable medical apparatus such as a lead, lead extension, or catheter. The wire may electrically couple elements such as connector electrodes to conducting electrodes or sensors.
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