Invention Grant
- Patent Title: Modular low stress package technology
- Patent Title (中): 模块化低应力包技术
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Application No.: US12903779Application Date: 2010-10-13
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Publication No.: US08639373B2Publication Date: 2014-01-28
- Inventor: Craig J. Rotay , John Ni , David Lam , David Lee DeWire , John W. Roman , Richard J. Ross
- Applicant: Craig J. Rotay , John Ni , David Lam , David Lee DeWire , John W. Roman , Richard J. Ross
- Applicant Address: US TX Coppell US CA Oakland
- Assignee: STMicroelectronics, Inc.,RJR Polymers, Inc.
- Current Assignee: STMicroelectronics, Inc.,RJR Polymers, Inc.
- Current Assignee Address: US TX Coppell US CA Oakland
- Agency: Leveque IPLaw, P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembly.
Public/Granted literature
- US20110087356A1 MODULAR LOW STRESS PACKAGE TECHNOLOGY Public/Granted day:2011-04-14
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