An arrangement for creating a set of wafer transfer instructions configured to transfer a wafer between an origination wafer-holding location and a destination wafer-holding location in a plasma cluster tool is provided. The arrangement includes means for receiving a first user-provided location indicator and a second user-provided location indicator on an on-screen graphical representation of the plasma cluster tool. The arrangement also includes means for ascertaining data pertaining to a set of paths between the first user-provided location indicator and the second user-provided location indicator. The arrangement further includes means for forming the set of wafer transfer instructions responsive to the data pertaining to the set of paths, the set of wafer transfer instructions being configured to transfer the wafer along a set of wafer-holding locations associated with one of the set of paths.