Invention Grant
- Patent Title: Strength enhancing insert assemblies
- Patent Title (中): 强度增强插件组件
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Application No.: US11628072Application Date: 2004-09-03
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Publication No.: US08640428B2Publication Date: 2014-02-04
- Inventor: Niranjan Krishna Naik , Nageswara Rao Ganji
- Applicant: Niranjan Krishna Naik , Nageswara Rao Ganji
- Applicant Address: IN Mumbai IN Bangalore
- Assignee: Indian Institute of Technology, Bombay,Indian Space Research Organization, Bangalore
- Current Assignee: Indian Institute of Technology, Bombay,Indian Space Research Organization, Bangalore
- Current Assignee Address: IN Mumbai IN Bangalore
- Agency: Holland & Bonzagni, P.C.
- Agent Mary R. Bonzagni, Esq.
- Priority: IN496/MUM/2004 20040430
- International Application: PCT/IN2004/000274 WO 20040903
- International Announcement: WO2005/106258 WO 20051110
- Main IPC: E04C2/54
- IPC: E04C2/54

Abstract:
Insert assemblies of high specific strengths to reduce stress concentration at locations where Multidirectional stresses act on sandwich structures have been designed based on mapping stress distribution and failure initiation. The insert assembly comprises of insert (10, 20, 30), potting material (14, 24, 34), core (17, 27, 37), lower face plate (16, 26, 36), Upper face-plate (15, 25, 35) and attachment (13, 23, 33). The insert materials are selected from 2D woven composites, 3D thermoelastic isotropic woven composites, 3D woven composites, 3D woven composites with multiple inserts and 3D functionally gradient woven composites. Specific strengths of inserts (10, 20, 30) of present invention are higher than the inserts of prior art.
Public/Granted literature
- US20080008521A1 Novel Strength Enhancing Insert Assemblies Public/Granted day:2008-01-10
Information query
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