Apparatus and method for tire temperature measurement is disclosed. The apparatus includes a thermocouple having a measurement junction and a pair of first and second conductive leads. The measurement junction is mounted in a passage provided in the tire. The pair of first and second conductive leads extend through the passage in the tire and exit the tire at an interface. A patch is mounted to the tire at the interface. The pair of first and second conductive leads extend from the interface into a passage provided in the patch. The first and second conductive leads are surrounded by the patch at the interface where the first and second conductive leads exit the surface of the tire.