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US08640538B2 Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same 有权
流量传感器及其制造方法和流量传感器模块及其制造方法相同

Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same
Abstract:
Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).
Abstract(Chinese):

提供了抑制每个流量传感器的性能变化的技术。 在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。 由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂 半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。 此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

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