Invention Grant
US08640552B2 MEMS airflow sensor die incorporating additional circuitry on the die
有权
MEMS气流传感器芯片在芯片上结合有额外的电路
- Patent Title: MEMS airflow sensor die incorporating additional circuitry on the die
- Patent Title (中): MEMS气流传感器芯片在芯片上结合有额外的电路
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Application No.: US13226264Application Date: 2011-09-06
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Publication No.: US08640552B2Publication Date: 2014-02-04
- Inventor: Mohammed Abdul Javvad Qasimi , Lamar Floyd Ricks
- Applicant: Mohammed Abdul Javvad Qasimi , Lamar Floyd Ricks
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Seager Tufte & Wickhem LLC.
- Main IPC: G01F1/86
- IPC: G01F1/86
Abstract:
A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.
Public/Granted literature
- US20130055826A1 MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE Public/Granted day:2013-03-07
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