An apparatus for facilitating cutting of unit dose blisters from a blister card is provided. The apparatus may include a platform, a clamp, a blade and a sensor. The blister card may be positionable on the platform for cutting. The clamp may be positionable to hold a portion of the blister card in contact with the platform for cutting when the clamp is seated. The clamp may be operatively coupled to a guillotine head. The blade may also be operatively coupled to the guillotine head. The guillotine head may be configured to move the blade through a range of motion that intersects a plane of the platform. The sensor may be positioned to detect a seating status of the clamp to enable control of movement of the guillotine head based on the seating status.