A dual-interface smart card comprises an integrated circuit (IC) module coupled to a plastic card body. The IC module includes multiple downwardly facing, externally exposed contact pads that are electrically coupled to corresponding externally exposed sections of a radio frequency (RF) antenna incorporated into the card body. Each contact pad is electrically connected to the RF antenna by a pair of opposing, stapled-shaped, conductive elements, with one conductive element being permanently welded to the contact pad and the other permanently welded to the antenna. Each conductive element includes a pair of resilient spring arms that maintain electrical connection between the contact pad and the antenna even upon movement of the IC module relative to the card body. To provide further redundancy of connection between each contact pad and the antenna, the resilient spring arms of the opposing conductive elements are encapsulated with a supply of conductive filler material.