Invention Grant
- Patent Title: Interface assembly, consolidation tooling and method of mounting an interface assembly to a substrate
- Patent Title (中): 接口组件，固结工具和将接口组件安装到基板的方法
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Application No.: US12513060Application Date: 2007-10-31
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Publication No.: US08641294B2Publication Date: 2014-02-04
- Inventor: Gareth L. Bannister
- Applicant: Gareth L. Bannister
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: GB0621753.3 20061031
- International Application: PCT/GB2007/004154 WO 20071031
- International Announcement: WO2008/053211 WO 20080508
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/00
Abstract:
An assembly, in particular for interfacing an embedded element, in particular a waveguide, at the surface of a substrate, such as a composite panel which forms part of a vehicle, typically an aircraft, to an external module, consolidation tooling for mounting an assembly to a substrate, and a method of mounting an assembly to a substrate.
Public/Granted literature
- US20100296792A1 INTERFACE ASSEMBLY, CONSOLIDATION TOOLING AND METHOD OF MOUNTING AN INTERFACE ASSEMBLY TO A SUBSTRATE Public/Granted day:2010-11-25
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