Invention Grant
- Patent Title: Heat radiating connector
- Patent Title (中): 散热连接器
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Application No.: US13387048Application Date: 2011-04-06
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Publication No.: US08641444B2Publication Date: 2014-02-04
- Inventor: Haruki Yoshida , Yoshiaki Ozaki
- Applicant: Haruki Yoshida , Yoshiaki Ozaki
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-103403 20100428
- International Application: PCT/JP2011/059126 WO 20110406
- International Announcement: WO2011/136019 WO 20111103
- Main IPC: H01R13/00
- IPC: H01R13/00

Abstract:
For an object of providing a connector which has improved heat radiating efficiency, the connector includes a terminal 2 including a wire connecting portion 21 which an electric wire is connected, and a connector housing 3 provided with a terminal receiving section 30 receiving the terminal 2. Heat radiating portions 45, 55 are provided at a position of the terminal receiving portion 30, at which the wire connecting portion 21 is covered. In the heat radiating portions 45, 55, a plurality of projections 49, 59 formed to project from the surface 4a, 5a of the terminal receiving section 30 is arranged at intervals to each other.
Public/Granted literature
- US20120122345A1 CONNECTOR Public/Granted day:2012-05-17
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