Invention Grant
- Patent Title: Crimp terminal, connection structural body and method for producing the crimp terminal
- Patent Title (中): 压接端子,连接结构体及压接端子的制造方法
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Application No.: US13567626Application Date: 2012-08-06
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Publication No.: US08641461B2Publication Date: 2014-02-04
- Inventor: Kengo Mitose , Yukihiro Kawamura
- Applicant: Kengo Mitose , Yukihiro Kawamura
- Applicant Address: JP Tokyo JP Shiga
- Assignee: Furukawa Electric Co., Ltd.,Furukawa Automotive Systems Inc.
- Current Assignee: Furukawa Electric Co., Ltd.,Furukawa Automotive Systems Inc.
- Current Assignee Address: JP Tokyo JP Shiga
- Agency: Osha Liang LLP
- Priority: JP2010-024607 20100205
- Main IPC: H01R4/10
- IPC: H01R4/10

Abstract:
Has an object of providing a crimp terminal, a connection structural body, and a method for producing the crimp terminal, which has a conducting function with certainty, with no galvanic corrosion occurring due to an electric wire and the terminal formed of different metal materials. A crimp terminal 1 includes a box section, and a pressure-bonding section including a wire barrel section and an insulation barrel section, which are provided in this order. The crimp terminal is formed of a metal plate which is formed of a copper alloy having a higher potential than aluminum used to form core wires of an insulated wire which is to be pressure-bonded by the pressure-bonding section. The crimp terminal 1 includes, in at least a part thereof, a resin cover section for covering a surface of the metal plate with a resin.
Public/Granted literature
- US20130040509A1 CRIMP TERMINAL, CONNECTION STRUCTURAL BODY AND METHOD FOR PRODUCING THE CRIMP TERMINAL Public/Granted day:2013-02-14
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