Invention Grant
- Patent Title: Packaging method of light emitting device
- Patent Title (中): 发光装置的封装方法
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Application No.: US13541771Application Date: 2012-07-05
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Publication No.: US08641469B2Publication Date: 2014-02-04
- Inventor: Chang-Ting Lin
- Applicant: Chang-Ting Lin
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW98145958A 20091230
- Main IPC: H01J9/00
- IPC: H01J9/00
Abstract:
A packaging method includes the following steps. A cover substrate is provided. A blocking dam having a first height is formed in the peripheral region of the cover substrate. The blocking dam has a second height after being hardened. A sealant surrounding the blocking dam and having a third height is formed. An encapsulation glue is filled in the active region of the cover substrate, and blocked by the blocking dam. A device substrate is provided, and a compression process is performed on the device substrate and the cover substrate. After the compression process, a buffer space is formed between the blocking dam and the sealant and between the cover substrate and the device substrate to accommodate the encapsulation glue spilling out of the active region of the cover substrate. The sealant is hardened, so that the cover substrate and the device substrate are bonded together through the sealant.
Public/Granted literature
- US20120276667A1 PACKAGING METHOD OF LIGHT EMITTING DEVICE Public/Granted day:2012-11-01
Information query
