Invention Grant
- Patent Title: Copper alloy sheet material and method of producing the same
- Patent Title (中): 铜合金板材及其制造方法
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Application No.: US12958109Application Date: 2010-12-01
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Publication No.: US08641838B2Publication Date: 2014-02-04
- Inventor: Hiroshi Kaneko , Kiyoshige Hirose , Koji Sato
- Applicant: Hiroshi Kaneko , Kiyoshige Hirose , Koji Sato
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-145707 20080603
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22F1/08 ; H01B5/02
Abstract:
A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.
Public/Granted literature
- US20110073221A1 COPPER ALLOY SHEET MATERIAL AND METHOD OF PRODUCING THE SAME Public/Granted day:2011-03-31
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