Invention Grant
- Patent Title: Method for spacing electrical conductors and related devices
- Patent Title (中): 隔离电导体和相关设备的方法
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Application No.: US12188553Application Date: 2008-08-08
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Publication No.: US08641855B2Publication Date: 2014-02-04
- Inventor: William F. Jones
- Applicant: William F. Jones
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: H02K15/10
- IPC: H02K15/10
Abstract:
A method of spacing a plurality of electrical conductors for carrying electrical current in an electrical machine may include positioning between the electrical conductors an uncured spacer body. The uncured spacer body may include a curable material, and an activatable heat generating material mixed with the curable material. The method may further include activating the activatable heat generating material to heat the curable material to form a cured spacer to thereby space the electrical conductors in the electrical machine.
Public/Granted literature
- US20090079290A1 METHOD FOR SPACING ELECTRICAL CONDUCTORS AND RELATED DEVICES Public/Granted day:2009-03-26
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